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US Patent Issued to Acer on Aug. 25 for "Electronic package module" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,169, issued on Aug. 25, was assigned to Acer Inc. (New Taipei City, Taiwan). "Electronic package module" was invented by Yu-Shih Wang (New ... और पढ़ें


US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 25 for "Package structure and method of fabricating the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,170, issued on Aug. 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Package structure and method of fab... और पढ़ें


US Patent Issued to Analog Devices International UnLtd. on Aug. 25 for "Integrated curcuit to dielectric substrate transition" (American, Turkish Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,171, issued on Aug. 25, was assigned to Analog Devices International UnLtd. Co. (Limerick, Ireland). "Integrated curcuit to dielectric subs... और पढ़ें


US Patent Issued to SAMSUNG DISPLAY on Aug. 25 for "Display device and method for manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,172, issued on Aug. 25, was assigned to SAMSUNG DISPLAY Co. LTD. (Yongin-si, South Korea). "Display device and method for manufacturing the... और पढ़ें


US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 25 for "Seal rings in integrated circuit package and method" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,173, issued on Aug. 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Seal rings in integrated circuit pa... और पढ़ें


US Patent Issued to Micron Technology on Aug. 25 for "Semiconductor device having die ring conductor" (Japanese Inventor)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,174, issued on Aug. 25, was assigned to Micron Technology Inc. (Boise, Idaho). "Semiconductor device having die ring conductor" was invente... और पढ़ें


US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 25 for "Device crack-stop structure to prevent damage due to dicing crack" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,175, issued on Aug. 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Device crack-stop structure to prev... और पढ़ें


US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 25 for "Semiconductor device and methods of manufacture" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,176, issued on Aug. 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor device and methods of... और पढ़ें


US Patent Issued to Yangtze Memory Technologies on Aug. 25 for "Vertical memory devices" (Chinese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,177, issued on Aug. 25, was assigned to Yangtze Memory Technologies Co. Ltd. (Wuhan, China). "Vertical memory devices" was invented by Yuhu... और पढ़ें


US Patent Issued to Honeywell International on Aug. 25 for "Magnetic shielding for magneto resistive memory" (Minnesota Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,178, issued on Aug. 25, was assigned to Honeywell International Inc. (Charlotte, N.C.). "Magnetic shielding for magneto resistive memory" w... और पढ़ें